NS300+ HT delivers the high performance associated with TEL's proven series of scrubbers, with a boost in production of up to 500 wph with the same small product footprint. A well-established platform for advanced frontside and backside cleaning, the product employs parallel wafer processing, offers brush and DIW spray options, a chemical rinse for higher particle removal efficiency with low damage, and industry- leading bevel edge cleaning.

• High throughput (maximum of 500 wafers per hour)
• Same small footprint as earlier model
• Atomized Spray2
• Improved brush technology and liquid cleaner support (option)
• Lower running costs achieved through low DIW and reduced carbon dioxide emissions