CELLESTA -i achieves a throughput of 1,000 wph. Independent zones allow maintenance to occur in one zone while the other continues processing wafers. The product can be used for a variety of FEOL and BEOL process applications, including resist stripping, backside and bevel cleaning. The product features parallel wafer processing, controlled chamber ambient with low O2, compatibility with aggressive chemistries, and an automated chamber/exhaust cleaning system.

• Pre-diffusion and pre-CVD washing
• Post-etching washing
• Wet etching
• Resist stripping
• Backside and bevel washing
• Wiring processing polymer removal

• High throughput of up to 1,000 wafers per hour
• Small footprint
• Damage-free physical washing using atomizing spray
• Original drying technology that controls water marks and pattern damage
• Independent control of process environment in each chamber
• Spinner technology compatible with various applications

• *CELLESTA is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.