Trias W(tungsten)is a single wafer CVD system for contact plug and via fill applications. It uses a lamp heating technique which enables quick temperature changes and excellent coverage performance. The system provides high productivity and flexibility by providing both nucleation layer deposition using SFD and a bulk layer deposition using CVD in a single module. Moreover, a further lower resistibility film can be deposited, extending out to sub 65nm technology nodes.

• Contact plug, Via fill

• Wafer size : 300mm
• Number of process modules : 1 to 4
• Process : W deposition, WSi deposition

• *Trias is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.
• *SFD is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.