The Telius, TEL's etch system for 300mm wafer production, offers wide process latitude and outstanding cost performance. The Telius SP offers high productivity and throughput, a smaller footprint, and electric energy consumption savings as standard features. Multiple chamber configurations support various process applications. TEL also offers a CIP(Continuous Improvement Package), a retrofit option for the SCCM chamber, to address the needs of future miniaturization and particle reduction.

• DRM, SCCM Chambers
• Up to four chamber capability(photo shows two-chamber system)
• Flexible modular system expansion
• Same footprint as the 200mm UNITY IIe system
• High throughput, compact design and lower CoO
• Ease of maintenance

• *Telius is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.
• *SCCM is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.
• *UNITY is a registered trademark or a trademark of Tokyo Electron Limited in Japan and other countries.