Tokyo-February 1st, 2010 - Tokyo Electron Limited (TEL) announced today that the company has begun accepting orders for Trias e+, a new cluster tool platform for deposition of advanced materials.

Trias e+ follows in the footsteps of TEL’s “Trias”, a original single wafer CVD platform, which has become a benchmark for performance and reliability at memory and logic fabs worldwide. Trias e+ includes an array of features to improve wafer throughput, including a high-speed wafer handling system, a high-efficiency load lock and new control software that maximizes performance and efficiency. As a result, Trias e+ mechanical throughput is increased by 150% compared to the platform’s predecessor. The system has also been designed and engineered from the ground up for energy efficiency. Compared to the previous platform, electrical power consumption of Trias e+ is reduced by 50%. Further reductions in power consumption are expected as new, optimized process modules are introduced. Trias e+ has also undergone extensive testing at the component and system level to ensure that it continues Trias reputation for field-proven reliability.

Trias e+ deposition platform is compatible with all of TEL’s currently-available single wafer deposition and materials processing modules, including Ti/TiN CVD, High-k CVD, and SPAi. Later this year, TEL will begin offering a new line of process modules designed specifically to work with Trias e+ to achieve new levels of process performance, efficiency, reliability and extendibility. Dubbed the NX series, the new chambers will incorporate optimized gas dynamics and a new, highly precise wafer heating method that combine to provide enhanced film uniformity and process repeatability. NX Ti and NX TiN modules for deposition of titanium and titanium nitride films will be available in June 2010. The NX modules will be fully compatible with TEL’s current suite of film deposition processes, which will allow customers to readily transfer their existing manufacturing processes to NX chambers.

“In recent years, semiconductor manufacturers have introduced new materials into the chip-making process to address the limitations of traditional device scaling”, said Go Okubo, Vice President and General Manager of TEL’s Single Wafer Deposition Business Unit. “The true benefits of advanced materials are realized when they are implemented in production fabs, and our customers need deposition tools that address the technical and manufacturing challenges of the semiconductor industry. As the number one supplier to the LPCVD market, TEL responds to our customers’ needs with Trias e+ platform and NX process chambers, which combine technology and efficiency in a reliable, extendable, manufacturing-ready package.”

Trias e+