Tokyo, Japan - Tokyo Electron Limited (TEL), a world leader in thermal processing systems, today announced that the company will introduce TELINDY PLUS in April 2008 for high-volume manufacturing.



TEL has shipped more than 500 TELINDY systems since 2006. Now TEL introduces TELINDY PLUS, the latest evolution in the TELINDY product line. TELINDY PLUS offers enhancements, such as increased productivity and platform performance. The new platform is capable of both conventional processes, such as oxidation/anneal/LPCVD, and advanced processes, such as High-k dielectrics/LPRO/SiN/Low Temperature CVD, and in-situ dry gas cleaning.



TELINDY batch thermal processing systems provide significant cost-of-ownership advantages over conventional furnaces. TELINDY PLUS incorporates key features, including improved FIMS and a newly designed wafer handling system resulting in a 20% O.H.T.(Over Head Time) reduction. The system also offers optimal laminar flow and efficient heat exchange resulting in reduced wafer handling time, and a 20+% reduction in N2 consumption, all while maintaining a tighter control of the reactor ambient temperature and smaller footprint.



With the TELINDY PLUS, the TEL Thermal Processing group continues to make breakthrough advancements in thermal processing technology through the ongoing development of more efficient reactors that address the technical requirements faced by semiconductor manufacturers in their efforts to develop sub-32nm nodes and beyond.