Tokyo Electron Ltd. (TEL) has announced the release of the company's new Probing Accuracy Diagnosis System, TELPADS-O. Integrated with TEL's 300mm fully automatic wafer prober, the P-12XLm, the new system provides users with off-line, high speed probe mark inspection analysis.

Trends in the wafer probing market have led to an increasing number of DUT's tested in parallel for memory applications, as well as an increasing number of device pins per die in SOC applications. Inspection and analysis of the probe marks made during and after testing at the wafer level is crucial in maintaining the quality of back-end processing due to the fine pitch of bonding pads and multiple test steps.

To meet this market challenge, TELPADS-O provides throughput improvements of 50-100x compared to current probe mark inspection (PMI) capabilities. Integration with TEL's fully automatic wafer prober creates an automated PMI solution that allows customers to maximize uptime of the test cell. Furthermore, TEL's automated PMI methodology eliminates the need for manual inspection with a microscope, thereby reducing the need for operator interaction.

"We are excited to provide this innovative high speed probe mark inspection engine to customers, which offers users a fast and accurate solution to meet their expanding probe mark inspection demands," said Steve Nagasawa, VP & General Manager of TEL's Test Systems Business Unit.

TELPADS-O is also capable of providing quantitative data analysis of many probe mark parameters, resulting in enhanced process control and optimal wafer testing efficiency, including probe card quality control.

To learn more about TEL's new product, please visit us at Semicon West Booth 5568 at the Moscone Center, North Hall. Semicon West attendees may also register for TEL's probe technology seminar to be presented at Semicon West at the Moscone, West Hall, 3rd Level, Room 3010 on July 11 from 10:30 to 12:00 or At 1:30 to 3:00. Please visit http://www.tel.com/probeseminar for more information.