TOKYO - Tokyo Electron Limited (TEL) has announced that the company will begin accepting volume orders for their latest 300mm single wafer cleaning system, CELLESTA™, in April of 2006.

The CELLESTA targets FEOL critical cleans, advanced gate, and surface preparation for 90nm technologies, down to 45nm and beyond. It employs a unique and environmentally friendly Single Vapor Ozone Strip system for resist removal. CELLESTA also offers two wet spin chamber options for FEOL surface preparations using SC1, SC2, and HF chemistries. The Single Vapor Ozone Strip system and wet-spin processes provide improved oxide removal control and reduced silicon loss in critical advanced gate areas. Combinations of these chambers can successfully process the most advanced technologies facing the semiconductor industry today.

"CELLESTA addresses our customers' needs for future single wafer surface preparation technologies for 45nm and beyond through proven performance, environmentally friendly operation, reduced cost of ownership, and process flexibility", stated Masaaki "Ben" Hata, the TEL Surface Preparation Systems General Manager.

The system employs a new high performance spin dryer module, providing customers with the flexibility to run a wide variety of FEOL cleaning applications. TEL's original advanced IPA drying technology solves problems generally associated with standard drying techniques, including eliminating watermarks and damage on sensitive structures. CELLESTA also includes the Atomized Spray advanced surface clean, which provides high particle removal efficiency (PRE) with no pattern or surface structure damage. The Atomized Spray is available with SC1.

The CELLESTA is based on TEL's market-leading CLEAN TRACK ACT® 12 platform, ensuring reliability and high process performance, and maximizing cost effectiveness. Customers may also choose to integrate TEL's Ingenio™ software for advanced group control and fault detection to reduce downtime and support product maintenance.