TOKYO––November 26, 2004––Tokyo Electron Limited (TEL) announced Friday that it will begin sales of the P-12XLm 300mm wafer prober and P-8XLm 200mm wafer prober. So far, TEL has delivered more than 2,300 units of the 300mm wafer prober P-12XL series and more than 7,300 units of the 200mm wafer prober P-8 series. Both of the new products are top-of-the-line models of the 300mm- and 200mm-compatible series.

Based on the P-12XLn+, which realized the industry's first contact precision of ±1.8μm, the P-12XLm is equipped with a state-of-the-art optical system that improves the alignment capability of small-pitch, micro-diameter probe-tip cards used to wafer test small geometry products. It also improves manufacturing efficiency thanks to a new loader with improved throughput. TEL will begin accepting orders for the P-12XLm in December 2004, with an estimated 500 units to be shipped in the first year.

The P-8XLm has realized an XY contact precision of ±2.0μm by using the high-rigidity, high-precision XYZ probing technology of the P-12XL series. As with the P-12XLm, the P-8XLm is equipped with a state-of-the-art optical system and displays maximum performance when used to test high-performance next generation technology node devices. In addition, options are available to enable testing at temperature ranges from -55ºC to 150ºC as well as the measurement of low currents using a triax chuck. TEL will begin accepting orders for the P-8XLm in December 2004, with an estimated 250 units to be shipped in the first year.

The P-12XLm and P-8XLm are both software-compatible with existing models of the P-12XL series and P-8 series, making it possible to operate them under the same environment.