SANTA CLARA, CA--Timbre Technologies, Inc., a TEL company, announces the release of their next generation Optical Digital Profilometry (ODP) metrology product, TeraGen 2.0. TeraGen 2.0 supports Timbre's smart spectra technology,

which increases modeling accuracy and productivity, and combines

expanded feature analysis programs. Other advances of the system

include the option of 3D capability for Integrated Metrology (IM)

applications, as well as support of additional optical hardware

systems/suppliers.



TeraGen 2.0 provides three-dimensional modeling capability for TEL

CLEAN TRACK coater/developer's IM applications, geared toward contact

and via layer designs. Considerable research and development have gone

into this function, enabling ODP to offer the fastest and most

accurate solutions in the industry.



"The great functionality of the new release will give our product

a quantum leap in ODP, and reinforce our strong customer positions,"

says Junwei Bao, Sr. Director of Technology and Engineering for Timbre

Technologies. "Timbre released our prototype 3D technology a year ago,

and we have now incorporated customer feedback into a truly practical

product. Since the release of 2.0, we've heard quite a few compliments

from users on the new features and stability of the system, as well as

how easy it is to use. I am glad our customers are continuing to

benefit from these leading edge developments."



Other enhancements of TeraGen 2.0 include improved usability, data

integrity verification and increases in speed for both modes of ODP

operation: run-time regression and library generation. The dual mode

functionality of TeraGen 2.0 allows customers to fully utilize TeraGen

in development cycles and in full production. The productivity

improvements in TeraGen 2.0 offer customers improved performance in

manufacturing, process window characterizations, process designs and

system qualifications.