TOKYO, JAPAN, JULY 8, 2002 -Tokyo Electron Limited (TEL; Head Office: Minato-ku, Tokyo; C.E.O., President: Tetsuro Higashi) has announced the development of the next generation 300mm process coater/developer targeting the 300mm wafer market. This project represents TEL's continued investment in research and development to meet our customer's future needs.

The new system will combine technologies accumulated through TEL's world market leading resist coater/developers, the CLEAN TRACK ACT® series, with the most advanced technology acquired through TEL's research and development activities. TEL plans to release this next generation 300mm process coater/developer, which is currently under development, in January 2004.

With the experience and knowledge on 300mm wafer processes gained though the success of the CLEAN TRACK ACT 12, TEL's new system will not only provide the most advanced process capability and highest levels of productivity for 300mm, but also offer commercial advantages such as reduced lead-times and start-up periods and quicker service support in order to meet the customer's expectations. With this new system, TEL also plans to provide the most advanced solutions for fab automation and network implementation.

*CLEAN TRACK ACT is registered trademark of Tokyo Electron Limited.